PRODUCT DESCRIPTION
LOCTITE ABLESTIK JM 7000 provides the following product
characteristics:
Technology
Cyanate Ester
Appearance
Silver
Cure
Heat cure
Filler Type
Silver
Product Benefits
●
Excellent adhesion
●
Low moisture in cavity
●
Low weight loss during cure
●
Low ionic impurities
●
High reliability
●
Minimal voiding
●
Electrically conductive
●
Thermally conductive
Application
Die attach
Substrates
Alumina, Gold plated alumina and Heat
sinks
Typical Package
Application(s)
VLSI packages, Solder sealed ceramic
packages and Solder sealed hermetic
packaging
LOCTITE ABLESTIK JM 7000 die attach adhesive has been
formulated for use in high throughput die attach applications. This
material has been used successfully on rigid substrates with die
sizes up to 700 mils.
LOCTITE ABLESTIK JM 7000 has been approved by DESC and
Rome Laboratory for military products.
TYPICAL PROPERTIES OF UNCURED MATERIAL
Viscosity, HAAKE RV-20 Rotoviscometer, mPa·s (cP):
Cone 1o @ Shear rate 22 s
-1
9,000
Work Life @ 25°C, hours
8 to 16
Shelf Life @ -40°C (from date of manufacture), days
365
TYPICAL CURING PERFORMANCE
Cure Schedule
30 minutes @ 150°C
Suggested temperature cures are from 150 to 350oC. For
applications requiring higher electrical conductivity, a cure cycle of
15 minutes @ 300oC is recommended. Product properties will not
be reduced by subsequent post die attach thermal exposure, i.e.,
wirebond, and/or lid seal up to 370oC.
The above cure profiles are guideline recommendations. Cure
conditions (time and temperature) may vary based on customers'
experience and specific application requirements, as well as
customer curing equipment, oven loading and actual oven
